Feature

• Down-Feed Grinding
  Constant load on the wafer surface area minimize the depth of damage and prevents edge chipping. Wafer thickness control can be made by in-situ measuring equipment.
• Grinding Spindle
  concave or convex can be easily obtained by making spindle angle adjustment.
• Air Bearing
  The air bearing is made from carbon graphite. It is seizure free even if power failure takes place.