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Multi Wafer Maker

This machine pursues to slice a wafer of more than 8″ for semiconductor with a stable cutting accuracy
The world’s first NC cutting program installed to the machine allows various and detailed cutting process.

Multi Wafer Maker

Feature

  • This machine is designed to achieve high-speed wire feed by electronically controlling the wire supply and take-up.
  • By adopting the method of slicing the workpiece while moving it down, the accuracy and efficiency are improved.
  • Automatic wire removal after slicing can smoothly be performed while moving the workpiece upward.
  • Highly accurate slicing by adopting highly rigid structure which prevents the machining heat from affecting accuracy

Specification

Item Description
Maximum work piece dimension Φ200mm、Φ300mm × L450mm
Maximum wire Speed 1000m/min
Cutting System Down Cut system
Cutting Feed speed 0.01-2.5mm
Maximum Wire capacity Φ0.14 × 600km
Number of Main roller AC 200V, 50/60Hz
Machine size 2000mm × 4040mm × 3184mm

※For detailed specifications, please contact us

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