PRODUCT & SERVICE
This machine pursues to slice a wafer of more than 8″ for semiconductor with a stable cutting accuracy
The world’s first NC cutting program installed to the machine allows various and detailed cutting process.

| Item | Description |
|---|---|
| Maximum work piece dimension | Φ200mm、Φ300mm × L450mm |
| Maximum wire Speed | 1000m/min |
| Cutting System | Down Cut system |
| Cutting Feed speed | 0.01-2.5mm |
| Maximum Wire capacity | Φ0.14 × 600km |
| Number of Main roller | AC 200V, 50/60Hz |
| Machine size | 2000mm × 4040mm × 3184mm |
※For detailed specifications, please contact us
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