PRODUCT & SERVICE
It is designed for large mounting plate (PLP), which can grind the PLP substrate on the chuck table continuously.
| Item | Unit | Data |
|---|---|---|
| Wafer size | mm | 510×415mm |
| Diameter of wheel | mm | φ500 |
| Number of simultaneous polishing wafers | piece | 1 |
| Chunk size | min-1 | 870mm |
| Weight | kg | 6000 |
※For detailed specifications, please contact us
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