PRODUCT & SERVICE
Non-contact automatic measurement of the shape and size of both edge and notch wafers after wafer grinding
| Item | Description |
|---|---|
| Wafer Size | ~300 mm |
| Wafer Thickness Range | 500 ~ 1400 μm (Adjustable by changing lenses) |
| Dimensional accuracy | 1 μm |
| Angle accuracy | 0.1° |
| Dimensional correction accuracy | 1 μm |
| Angle correction accuracy | 0.1° |
※For detailed specifications, please contact us
关于产品的咨询及相关事宜，请随时与我们联系。
