Edge Polishing System

This device adopts ver 2.0 polishing technology can realize one-time polishing of the edges of silicon wafers of various specifications, meeting the polishing requirements of semiconductor grade silicon wafers.

Feature

Dry in / wet out system.
two sets of VN polishing drums + two sets of v2.0 edge polishing drums.
Dual sensors work at the same time, and the VN position confirmation time is halved.
The VN position confirmation platform and each processing department are equipped with an air blowing mechanism to reduce the residue of water and polishing liquid.

Specification

Item	Description
Wafer size	φ100～φ300mm
Wafer thickness	0.7～1.5mm
Bevel angle	R,22°
VN shape	Semi specification
Wafer clamping	Edge clamping type
Power	AC 200V, 50/60Hz
Basic dimensions	W1900mm × D3220mm × H2350mm