Grinding Machine

It is a fully automatic down-feed grinding machine, designed to grind semiconductor materials such as silicon, carbide, ceramics, glass, and other brittle materials with high speed and extremely high accuracy.

Feature

Down-Feed Grinding
Constant load on the wafer surface area minimize the depth of damage and prevents edge chipping. Wafer thickness control can be made by in-situ measuring equipment.
Grinding Spindle
concave or convex can be easily obtained by making spindle angle adjustment.
Air Bearing
The air bearing is made from carbon graphite. It is seizure free even if power failure takes place.