PRODUCT & SERVICE
300mm wafer fully automatic final polisher targeted for the extremely high
level edge profile and removal uniformity
| Item | Unit | Data |
|---|---|---|
| Wafer size | mm | φ300 |
| Diameter of platen | mm | φ800 |
| Number of simultaneous polishing | piece | 2 |
| Speed of platen | min-1 | 10-80rpm |
| Weight | kg | 8,800 |
※For detailed specifications, please contact us
关于产品的咨询及相关事宜，请随时与我们联系。
