Cleaver

This equipment cuts a scribed wafer into chips by the blade. A wafer is loaded manually by an operator and is automatically aligned and broken into chips.

Feature

Stable load adjustment.
Various descriptions can be made through parameter settings.
the back side can be scribed through the lower camera. (option)
By adding a full field camera, you can automatically scribe multiple bars at high speed.

Specification

Item	Description
Wafer Size	Maximum 4 inches
Work Area	100mm x 100mm
Chip Size	Minimum: 200μm
Wafer Ring	Flat Ring
Equipment size	(W)705 × (D)705 × (H)1450mm (excluding signal lamp)