Diamond Scriber

This equipment is applicable to GaAs, InP and other compound semiconductor substrates. Diamond tools are used to scribe on wafers or bars, so that subsequent Cleaver machine can split them into bars or chips.

Feature

The diamond cutter is fixed, and the marking operation is performed by moving the workbench.
Through the image recognition system to perform automatic alignment, the primary / secondary scribing and full scribing can be realized.
Full field low power mirror is set to perform pre scanning and improve equipment operation efficiency.

Specification

Item	Description
Wafer Size	Maximum 4 inches
Work Area	100mm x 100mm
Chip Size	Minimum: 200μm
Wafer Ring	Flat Ring
Equipment size	(W)670 × (D)855 × (H)1200mm (excluding signal lamp)