Plasma Enhanced CVD System

This system offers all of the standard features for PECVD in a very compact footprint. Films with superior thickness uniformity and stress control can be deposited over a 220 mm diameter area with excellent stability and repeatability.

Feature

Processing up to ø220 mm (ø3″ x 5, ø4″ x 3, ø8″ x 1)
Superior uniformity and stress control
Excellent process stability and repeatability
Robust system with minimal running / maintenance cost
User-friendly touch screen interface for parameter control and recipe storage.

Specification

Item	Description
Reaction Chamber	Aluminum, inner diameter 341 mm
Upper Electrode	Aluminum, ø277 mm
Lower Electrode	Stainless steel, ø260 mm
RF Power	13.56 MHz, max. 300 W, crystal oscillation, automatic matching
Gas Inlet Lines	Max. 8 lines
Work piece size	Max Ø8inch