Ion Beam Milling System

As a precision processing equipment for dry etching process, this equipment can be applied to the production of thin film magnetic heads, compound semiconductors, SAW devices, etc. In addition, it is also widely used in R&D. It is especially suitable for ion etching of magnetic materials, Au, Pt, and various alloys.

Feature

Light source: Halogen lamp (with 550nm filter)
Inspection time: Image is displayed instantaneously.
Rotary system: Normal rotation, reverse rotation, inching motion and one rotation
It can detect asperity, warpage, polishing unevenness and others with high sensitivity.

Specification

Item	Description
Wafer Size	Circular wafers and Irregular wafer
Ion Source	Kauffman-type
Substrate size/number of sheets	Customize
Process Gas	Ar gas, etc.
Etching uniformity	≦±5%
Etching rate	Si: ≧10 (nm/min)