产品 & 服务

PRODUCT & SERVICE

PLP Grinding Machine

It is designed for large mounting plate (PLP), which can grind the PLP substrate on the chuck table continuously.

HPMJ assist
It can remove the metal residue blocked in wheel during processing
Before processing, Measure the thickness of the substrate during processing.
The chuck table can be shuttled between grinding and loading/unloading positions.

Item	Unit	Data
Wafer size	mm	510×415mm
Diameter of wheel	mm	φ500
Number of simultaneous polishing wafers	piece	1
Chunk size	min-1	870mm
Weight	kg	6000

※For detailed specifications, please contact us

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