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Load-Lock Type Sputter

This medium-sized device can form functional films, including decorative and nitride films.

Load-Lock Type Sputter

Feature

  • high-density thin optical films with no wavelength shift
  • Supports low temperature formation of films for a range of applications
  • A workable lifter enables easy removal of substrate drum
  • Automatic sputter control system enables automated sputtering
  • Compact design and more efficient film production reduce CO2 emissions

Specification

Item Description
Installed Baseboard Vertically-placed rotary drum
Evacuation Period (process) < 1E-3Pa within 30 min
Evacuation Period (Load-lock) From atmospheric pressure to 7Pa within 7 min.
Achievable Vacuum Pressure 1E-4Pa or less
RAS Structure Sputter Source + Oxidation Reaction Source

※For detailed specifications, please contact us

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