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Polishing Machine

300mm wafer fully automatic final polisher targeted for the extremely high
level edge profile and removal uniformity

Polishing Machine

Feature

Best seller 300mm final polisher.
Achieve ultra mirror and luminance surface at the atom level.
Polish stage has 3 platen.1st, 2nd, 3rd platen, 6 wafers polishing simultaneously
PBest solution for reclaim wafer and TSV wafer which require the large amount of polish removal.

Specification

Item	Unit	Data
Wafer size	mm	φ300
Diameter of platen	mm	φ800
Number of simultaneous polishing	piece	2
Speed of platen	min-1	10-80rpm
Weight	kg	8,800

※For detailed specifications, please contact us

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